LE-UV showdown at Heidelberg open house

By Simon Nias, Friday 17 October 2014

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Heidelberg will pit conventional drying technology versus low-energy UV (LE-UV) drying at its Hei Tech Challenge open house next month.

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There are only 50 places on each of the four Hei Tech Challenge tours

The centrepiece of the event will be two Speedmaster B2 presses running different drying technologies - an SX 74 featuring LE-UV drying and an XL 75 running conventional oil-based inks with IR drying - to give printers an insight into the benefits of each.

Both presses will run jobs side-by-side on a range of different stocks to allow the colour and quality results to be compared objectively. Heidelberg will also reveal the real-life cost comparisons and maintenance considerations for the different processes.

"We sell both options so have no axe to grind," said Heidelberg UK sales director Jim Todd. "We want our customers to know which route is right for their specific business model, what will be right for their market and enable them to run profitably."

The tour will also include the BH and TH 56 folders to demonstrate how quickly sections from each press can be processed and will finish in the Prinect Room with an analysis of the total operational costs.

Visitors will also be able to pick up a copy of a White Paper, co-authored by Todd and Heidelberg press product specialist Matt Rockley, on the technical and business aspects of Mercury Vapour, LE-UV and LED UV curing.

The open house will take place from 12-13 November at Heidelberg's national showroom in Brentford. Places on the Hei Tech Challenge tours are limited to 50 for each of the four tours; printers can pre-register at the heievents.co.uk website.

The open house will also feature presentations from Tharstern on ways to add value to a traditional print business, and X-Rite on the new version of the ISO 12647-2 colour standard.

Other partner companies at the event include: Sappi, Polar, Winter & Co, Gallus, IST Metz, Anilox Laser Technology (ALT) and Print Finance.

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